Printed Circuit Fabrication and Assembly Processes |
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Round-1 / Round-2 | IRTI (Interconnect Technology Research Institute) analysis of "Black-pad" BGA failures |
Depaneling One, Two, Three | Various articles on depaneling of PWBs |
Dielectric tutorial | Article on various materials used in the manufacture of printed circuits. |
Flux compatibility | Article on precautions when mixing "No clean" fluxes from different vendors and product lines |
IPC Copper mirror | This is used to test the post reflow reactivity of soldering fluxes, i.e. if "No clean" really is |
Surface Insulation Resistance | This is used to test the post reflow resistance of soldering fluxes, i.e. if "No clean" really is |
No clean flux: Wash it? | Short blog post on cleaning "No clean" flux: Either do it completely, or not at all! |
PCB Etching | Negative process PCB etching using KPR |
Solder paste qualification | Lab report on the qualification of Amtech solder paste |
Any questions or comments?
This page last updated on
August 05, 2010